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 NCP1209 Product Preview PWM Voltage Mode Controller
The NCP1209P series is an enhanced version of the MC44608P series. It is a high performance voltage mode controller designed for fly-back SMPS. These 2 series are pin to pin compatible. The device is a Power MOSFET driver offering a discrete approach (controller + discrete MOSFET) for building an offline SMPS. It features a very high efficiency stand-by management consisting in a fully controlled and adaptable Pulsed Mode operation working in conjunction with a secondary reconfiguration.
Features http://onsemi.com
SMPS CONTROLLER WITH ENHANCED STAND-BY MANAGEMENT
MARKING DIAGRAMS
8 8 1 SO-8 CASE 751 PLASTIC 1 8 DIP-8 CASE 626 PLASTIC 1 1 TBD TBD
* * * * * * * * * * * *
45 kHz, 65 kHz, 77 kHz 7% Frequency Accuracy Over the Whole Temp Range Extended VCC Working Range 8.6 V to 16 V Programmable Stand-by Burst Duty Cycle Stand-by Mode Selection from the Secondary Side of the SMPS 5 mA VHV Start-up Current Source Device Inhibition Through Start-up Current Source Reduction Energy Management in Set Top Box Opto Feed-back Offline SMPS SMPS Using a Secondary Reconfiguration for the Stand-by Mode Ability to Adapt the MOSFET Gate Drive All General Purpose Fly-back SMPS
Typical Applications
8
This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice.
xx A WL, L YY, Y WW, W
= Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week
PIN CONNECTIONS
DMG 1 ICS 2 CTRL 3 GND 4 (Top View) 8 Vi 7 NC 6 VCC 5 OUT
ORDERING INFORMATION
Device NCP1209P45 NCP1209P65 NCP1209P77 Package TBD TBD TBD Shipping TBD TBD TBD
(c) Semiconductor Components Industries, LLC, 2002
1
January, 2002- Rev. 0
Publication Order Number: NCP1209/D
NCP1209
MAINS
RFI FILTER
1 + +
3 + SECONDARY RECONFIGURATION + 3 + 1 2 3 4 DMG ICS CTRL VCC GND OUT Vi 8 7 6 5
OFF = Pulsed Mode
No Specific Connection to the Primary Side
Figure 1. Typical Application Example MAXIMUM RATINGS
Rating VCC voltage Pin 3 sink and source current VHV pin8 voltage Total power supply current All inputs except Vi Power dissipation and Thermal characteristics Thermal Resistance, Junction to Air PDIP Thermal Resistance, Junction to Air SOIC Maximum power dissipation at TA = 85C PDIP Maximum power dissipation at TA = 85C SOIC Operating Junction Temperature Operating Ambient Temperature Symbol VCC Ipin3 Vpin8 ICC Vinputs RJA RJA PD PD TJ TA Value 18 3 500 20 -1.0 to +16 100 178 600 365 150 -25 to +85 Unit V mA V mA V C/W C/W mW mW C C
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NCP1209
ELECTRICAL CHARACTERISTICS (VCC = 10 V, TJ = 0C up 105C, Output Loaded with 1 nF)
Characteristic Output Section Output Resistor Sink Source Output Voltage Rise Time (from 3 V up to 8 V) Output Voltage Falling Edge Slew-Rate (from 8 V down to 3 V) Control Input Section Duty Cycle @ Ipin3 = 450 A Duty Cycle @ Ipin3 = 225 A Control Input Clamp Voltage (Switching phase) @ Ipin3 = -225 A Latched-off Phase Control Input (stand-by) @ Ipin3 = 75 A Latched-off Phase Control Input (stand-by) @ Ipin3 = 37 A Internal Pin3 Resistance (Isupply - ICC) / Ipin3 (75 A) (Isupply - ICC) / Ipin3 (75 A) Current Sense Section Maximum Sense Input Threshold Input Bias Current Current Sense Source Current during Start-up Phase Stand-by Current Sense Input Current LEB + Propagation Delay (P45) LEB + Propagation Delay (P65) LEB + Propagation Delay (P77) Current Sense Propagation Delay (Pin2 to OUT) (P45) Current Sense Propagation Delay (Pin2 to OUT) (P65) Current Sense Propagation Delay (Pin2 to OUT) (P77) Leading Edge Blanking TDLY - Tprg (P45) Leading Edge Blanking TDLY - Tprg (P65) Leading Edge Blanking TDLY - Tprg (P77) VCS-th IB-cs ICS-stup ICS-stby TDLY TDLY TDLY Tprg Tprg Tprg TLEB TLEB TLEB 0.9 -1.8 180 97 TBD TBD TBD TBD TBD TBD - - - 1.0 - 200 100 TBD TBD 350 TBD TBD 175 TBD TBD TBD 1.05 +1.8 220 103 TBD TBD TBD TBD TBD TBD - - - V mA mA mA ns ns ns ns ns ns ns ns ns D450 A D225 A Vshunt VLP-STBY VLP-STBY Rint3 K3(75) K3(37) - TBD 4.65 - - TBD - - - 43 4.9 TBD TBD 2 20 20 0 TBD 5.15 - - TBD - - % % V V V k - - W ROL ROH tr tf 5 - - - 8.5 15 50 50 15 - - - ns ns Symbol Min Typ Max Unit
Oscillator Section
Normal Operation Frequency (P45) Normal Operation Frequency (P65) Normal Operation Frequency (P77) Maximum Duty Cycle @ f = fosc fosc fosc fosc dmax 41.8 60.45 71.6 76 45 65 77 80 48.1 69.55 82.4 84 kHz kHz kHz %
Overvoltage Section
OVP threshold level on VCC Vcc-ovp 15.9 16.4 16.9 V
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NCP1209
ELECTRICAL CHARACTERISTICS (VCC = 10 V, TJ = 0C up 105C, Output Loaded with 1 nF)
Characteristic Symbol Min Typ Max Unit
Demagnetisation Detection Section
Demag Comparator Threshold (Vpin1 decreasing) Demag Comparator Hysteresis Propagation Delay (Input to Output, Low to High) Input Bias Current (Vdemag = 50mV) Negative Clamp Level @ Idemag = 50 A Positive Clamp Level @ Idemag = 50 A Vdmg-th Hdmg TPHL(In/Out) Idem-Ib Vcl-neg-dem Vcl-pos dem 45 - - -0.6 -0.9 9 50 30 300 - -0.7 10 55 - - - -0.4 11 mV mV ns mA V V
Overtemperature Section
Overtemp - 150 - C
Normal Mode Recovery Section
Demagnetisation Voltage for Normal Mode Recovery Vdem NM 2.38 2.4 2.52 V
Supply Section
Start-up Voltage Output Disabling VCC VCC Voltage for Istart-up activation 1st level start-up HV Current Source @ VCC < 1.5 V 2nd level start-up HV Current Source @ VCC > 3 V 2nd level start-up HV Current Source @ VCC = 10 V Vstup Vuvlo1 Vuvlo2 ICC1 ICC2L ICC2H Istup lk ICCS ICCS ICCS ICCOFF Dhiccup 11.8 8.2 5.03 100 3.2 2.2 - TBD TBD 2.2 350 - 12.4 8.6 5.3 200 4.2 3.2 70 - - 2.6 500 12.5 13 9 5.5 300 4.8 3.8 - TBD TBD 3 650 - V V V mA mA mA mA mA mA mA mA %
Start-up Current Source Leakage ICC when Switching (P45) ICC when Switching (P65) ICC when Switching (P77) ICC in the Latched Off Phase Hiccup Mode Duty Cycle
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NCP1209
PACKAGE DIMENSIONS
DIP-8 CASE 626-05 ISSUE L
8 5
-B-
1 4
NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC --10_ 0.76 1.01 INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC --10_ 0.030 0.040
F
NOTE 2
-A- L
C -T-
SEATING PLANE
J N D K
M
M TA
M
H
G 0.13 (0.005) B
M
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5
NCP1209
PACKAGE DIMENSIONS
SO-8 CASE 751-07 ISSUE W
-X- A
8 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D G H J K M N S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
B
1 4
S
0.25 (0.010)
M
Y
M
-Y- G C -Z- H D 0.25 (0.010)
M SEATING PLANE
K
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
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NCP1209
Notes
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NCP1209
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
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NCP1209/D


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